EN 
MY 
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Furnaces for Annealing and Various Film Deposition/Growth
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High Clean Bench
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Low Clean Bench
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Etch Bench
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Aluminum Etch Bench
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Metal Etch (Silicide Etch)
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Wafer Scrubber System
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Solvent Bench System
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High Current Ion Implanter System
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Medium Current Ion Implanter System
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Physical Vapour Deposition (PVD) System
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Rapid Thermal Processing (RTP) System
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Spin-on Glass (SOG) Coater System
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Film Stress Measurement System
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Four Point Probe System
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Fourier Transform Infrared Spectroscopy (FTIR)
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Wafer Marker
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Surfscan Inspection System
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Plasma Enhanced Chemical Vapour Deposition (PECVD) for Silicon Dioxide and Silicon Nitride Deposition
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Tungsten Silicide CVD System
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Tungsten CVD and Etchback System
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Sub-Atmospheric Chemical Vapour Deposition (SACVD) System
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Bare Wafer Inspection System
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Reactive Ion Etching (RIE) equipment for Films (Oxide, Nitride, Poly, AlCu, AlSiCu, Silicon) Etching
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Poly Backside Etcher
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Resist Asher
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Step Height System
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Film Thickness Measurement System
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Ellipsometer System
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Stepper System
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Scanner System
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Coater/Developer
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Deep Ultra Violet (DUV) System
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Oven System
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Overlay System
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Pattern Wafer Inspection System
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Critical Dimension Scanning Electron Microscope (CDSEM) System
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Inspection Microscope System
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Chemical Mechanical Polishing (CMP) System